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Skimming through the document it would appear they will be relying a lot on metallic components to cover pin holes and hydrophobic coating to do the work of bulky or water repellent seals like air-tight silicon or rubber. However they do it, they will be a massive hype campaign and huge show pit against Samsung with lots of meaningless paradoxes and keywords with trivial conjecture. I can't wait......
@anticpated wrote:Skimming through the document it would appear they will be relying a lot on metallic components to cover pin holes and hydrophobic coating to do the work of bulky or water repellent seals like air-tight silicon or rubber. However they do it, they will be a massive hype campaign and huge show pit against Samsung with lots of meaningless paradoxes and keywords with trivial conjecture. I can't wait......
I did a similar thing about 20 years ago by putting a big blob of superglue over some components on a small circuit board I'd etched to make it a bit waterproof. Makes me wonder how they even got the patent in the first place.
